Over the years, we've seen a good range of advancements in semiconductor design services. The Semiconductor Industry Association...
Over
the years, we've seen a good range of advancements in semiconductor design
services. The Semiconductor Industry Association (SIA) announced that the
worldwide semiconductor industry posted sales of $468.8 billion in 2018 - the
industry's highest-ever annual total and a rise of 13.7 percent over the 2017
sales.
As
the demand for semiconductor services continues to extend and therefore the
industry witnesses a broader range of latest technology innovations, we will
clearly see a move toward lower geometries (7nm, 12nm, 16nm, etc.). The key
drivers behind this trend are benefits in terms of the facility , area, plus
various other features that become possible with lower geometries.
The
proliferation of lower geometries has fuelled business during a number of
areas, especially within the sectors of mobility, communication, IoT, cloud, AI
for hardware platforms (ASIC, FPGA, boards).
Delivering
a lower technology design project on time is vital in today's dynamic and
competitive market. However, there are many unknowns at lower geometry which
impacts on project/product scheduled delivery. By keeping in mind the below
elements, it's possible to make sure on-time delivery at lower geometry nodes.
1.
Lower technology node's cost modeling
A
chip design leader provides the specified strong technical leadership and has
the general responsibility for the microcircuit design.
For
lower geometry design, engineers got to define the activities from
spec-to-silicon, sequence them within the right order, estimate the resources
needed, and estimate the time required to finish the tasks. At an equivalent
time, they have to specialise in the reduction of the entire system cost while
also satisfying specific service requirements. Following are the actions that
engineers can deem cost optimization:
Use
multiple patterning
Use
suitable design-for-test (DFT) techniques
Leverage
mask making, interconnects and process control
On
different layout methods because node cutting down isn't cost-economic anymore.
For continuous performance improvement along side cost control, some companies
are now pursuing a monolithic 3D ICs instead of a standard planar
implementation, as this will provide 30% power savings, 40% performance boost,
and cut the value by 5-10% without changing over to a replacement node.
2.
Advanced data analytics for smart chip manufacturing
In
the chip manufacturing process, an outsized volume of knowledge is generated on
the fab floor. Over the years, the number of this data has continued to grow
exponentially with each new technology node dimension. Engineers have played
instrumental roles in generating and analyzing data with the aim of improving
predictive maintenance and yield, improving R&D, enhancing product
efficiency and more.
Applying
advanced analytics in chip manufacturing can help to enhance the standard or
performance of individual components, cut-down test time for quality assurance,
boost throughput, increase equipment availability, and reduce operating costs.
3.
Efficient Supply Chain Management
As
new technology is usually released faster than the R&D timeline, everyone
within the chip-making industry is facing a drag in IC supply chain management.
the large question is: the way to improve efficiency and profitability during this
scenario.
The
answer is quicker deciding and efficient integration of varied suppliers,
requirements of clients, distribution centers, warehouses, and stores in order
that merchandise is produced with end-to-end supply chain visibility and
distributed within the right quantities, at right time to the proper location
to attenuate total system cost.
4.
Process for timely delivery
Improved
delivery to the customer may be a core a part of the semiconductor design
services. It includes setting-up order capturing to figure with orders at
runtime, cloud computing optimization, logistics, and therefore the transfer
the end-product to a customer - while keeping them up-to-date with every
required information at each stage. Planning the entire flow ensures that no
critical deadlines for the project are missed.
In
order to beat delays, semiconductor design companies can:
Minimize
the utilization of custom flows and shift towards place & route flows for
better physical data-path capabilities.
Set
and cling to quick reaction time to the client's requirements and alter
requests.
Get
real-time information from spec to silicon availability in terms of the
semiconductor design flow, location, reservation, and quantity.
Ensure
collaborative communication between teams performing on the project.
Focus
on criticality analysis - reducing the danger of functional failures of the
planning to stop business stoppers.
Gain
utilization expertise in multiple tools for managing the project.
Adopt
better technologies (TSMC, GF, UMC, Samsung), better methodology (Low power
consumption and high-speed performance), better tools (Innovus, Synopsys, ICC2,
Primetime, ICV).
How
is eInfochips positioned to serve the Market?
Whether
you would like to style innovative products faster, optimize R&D costs,
improve time to plug , enhance operational efficiency or maximize the return on
investment (ROI), eInfochips (an Arrow Company) is that the right design
partner.
eInfochips
has worked with many top global companies to contribute over 500 product
designs, with quite 40 million deployments round the world. eInfochips features
a large pool of engineers who possess specialization in PES services, with
attention on in-depth R&D and new development .
In
order to deliver product at short time-to-market, eInfochips provides ASIC,
FPGA and SoC design services supported standard interface protocols. It
includes:
Sign-off
services within the front (RTL design, Verification) and backend (Physical
design and DFT)
Turnkey
design services covering RTL to GDSII and style layout
Use
of Reusable IPs and framework that assist the corporate briefly development
time and price for faster and right time-to-market
This
blog is originally published at eInfochips.com.
Article
Source: http://EzineArticles.com/10107879
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